Associate Engineer, NPI Packaging

pSemi Corporation is a Murata company driving semiconductor integration. pSemi builds on Peregrine Semiconductor’s 30-year legacy of technology advancements and strong IP portfolio but with a new mission—to enhance Murata’s world-class capabilities with high-performance semiconductors. With a strong foundation in RF integration, pSemi’s product portfolio now spans power management, connected sensors, optical transceivers, antenna tuning and RF frontends. These intelligent and efficient semiconductors enable advanced modules for smartphones, base stations, personal computers, electric vehicles, data centers, IoT devices and healthcare. From headquarters in San Diego and offices around the world, pSemi’s team explores new ways to make electronics for the connected world smaller, thinner, faster and better.

Job Summary

The Associate NPI Packaging Engineer works under the guidance of a senior packaging and assembly engineer to support quick turn prototype assembly to facilitate pSEMI new product development. In addition, this position is responsible supporting implementation trials for SMT assembly processes under guidance, assisting with material tracking and proto-line equipment coordination (scheduling, basic upkeep) with direction from senior engineers and technicians. This position supports critical NPI development activities and requires high attention to detail, self-motivation, precision in task execution, delivering results according to an agreed upon schedule, seeking guidance when requirements are ambiguous and teamwork.

Roles & Responsibilities

This position has responsibility for:

• Assist in the development and optimization of the prototyping Surface Mount Technology (SMT) line for fully packaged, single die FCLGA, SiP, and PCB assembly.
• Coordinate actions with crossfunctional teams (design, assembly, test, reliability) for prototype builds; track lots and materials and provide status updates.
• Operation and recipe creation for SMT line equipment and processes in these key process steps.
• Paste / flux printers
• SMT pick-and-place
• Plasma clean
• Reflow Ovens
• Underfill / dam and fill compound dispensers
• Laser Marking equipment
• Saw singulation equipment.
• Work closely with packaging and assembly teams to support process robustness and manufacturability.
• Coordinate and set up of design of experiments (DOE’s) for improved process development.
• Equipment process documentation and procedure generation with approval from senior engineers.
• Collect data, produce basic analyses and standard reports (yields, voiding, placement accuracy, reflow profiles).
• Assist with fixture and jig updates or simple designs under supervision; manage fabrication requests and basic bring up.

Minimum Qualifications (Experience and Skills)

• 0–1 years related experience; internships or co‑ops acceptable.
• Ability to coordinate with external suppliers under supervision and track builds/data.
• Ability to follow standard procedures and work instructions with high attention to detail.
• Effective written and verbal communication; clear documentation skills.
• Foundational understanding of IC packaging concepts and basic manufacturing flow.
• Proficiency with office tools and willingness to learn CAD/analysis tools quickly.

Education Requirements

• Bachelor’s degree in a relevant Engineering or Physical Sciences field.

Work Environment

This job operates in a professional office environment. This role routinely uses standard office equipment.

Physical Demands

The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. While performing the duties of this job, the employee is regularly required to talk or hear. The employee frequently is required to stand; walk; use hands to finger, handle or feel; and reach with hands and arms. Specific vision abilities required by this job include close vision, distance vision, color vision, peripheral vision, depth perception and ability to adjust focus. This position requires the ability to occasionally lift office products and supplies, up to 20 pounds.

USD 77,496.66 - 100,751.24 per year

pSemi Corporation supports a diverse workforce and is committed to a policy of equal employment opportunity for applicants and employees. pSemi does not discriminate on the basis of age, race, color, religion (including religious dress and grooming practices), sex/gender (including pregnancy, childbirth, or related medical conditions or breastfeeding), gender identity, gender expression, genetic information, national origin (including language use restrictions and possession of a driver’s license issued under Vehicle Code section 12801.9), ancestry, physical or mental disability, legally-protected medical condition, military or veteran status (including “protected veterans” under applicable affirmative action laws), marital status, sexual orientation, or any other basis protected by local, state or federal laws applicable to the Company. pSemi also prohibits discrimination based on the perception that an employee or applicant has any of those characteristics, or is associated with a person who has or is perceived as having any of those characteristics.

Note: The Peregrine Semiconductor name, Peregrine Semiconductor logo and UltraCMOS are registered trademarks and the pSemi name, pSemi logo, HaRP and DuNE are trademarks of pSemi Corporation in the U.S. and other countries. All other trademarks are the property of their respective companies. pSemi products are protected under one or more of the following U.S. Patents: http://patents.psemi.com